Due to the continuous innovation of computer performance, more and more functions are integrated into the computer. Therefore, the processing capacity of the computer is increasing day by day, and these data include multimedia data and 3D animation data. In order to meet a large number of data processing requirements, more and more chipsets are put into the host, and at the same time, the operating frequencies of CPUs and chipsets are also increasing. More chipsets and faster clock frequencies mean more heat generation.

In addition to better performance of the temperature sensor, users require the system to be light, thin and small in appearance, which is another challenge faced by designers. In a limited space, how to dissipate the heat generated by the system is a tricky problem. How to take into account system performance, system comfort (including the temperature of the notebook computer case, the noise generated by the fan rotation), and system running time is an important issue in notebook computer design.

A typical system block diagram of a notebook computer. The CPU is the larger heat source in the system. At present, the INTEL Dothan processor commonly used in notebook computers has an instantaneous high power consumption of about 37W, and the AMD Athlon processor has an instantaneous high power consumption of about 35W to 40W. The instantaneous power consumption of INTEL's next-generation Merom processor will be as high as 50W. The CPU is an important target for temperature detection in computers. At present, whether it is an INTEL or AMD CPU, the CPU contains a diode for remote temperature detection, so as to provide a temperature sensor, directly detect the temperature of the die inside the CPU, and perform temperature control.